net-next: minor cleanups for bonding documentation
The section titled "Configuring Bonding for Maximum Throughput" is
actually section twelve not thirteen, and there are a couple of words
spelled incorrectly.
Signed-off-by: Rick Jones <rick.jones2@hp.com>
Reviewed-by: Nicolas de Pesloüan <nicolas.2p.debian@free.fr>
Signed-off-by: Jay Vosburgh <fubar@us.ibm.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
diff --git a/Documentation/networking/bonding.txt b/Documentation/networking/bonding.txt
index bfea8a3..6b1c711 100644
--- a/Documentation/networking/bonding.txt
+++ b/Documentation/networking/bonding.txt
@@ -1210,7 +1210,7 @@
documented above.
To create multiple bonding devices with differing options, it is
-preferrable to use bonding parameters exported by sysfs, documented in the
+preferable to use bonding parameters exported by sysfs, documented in the
section below.
For versions of bonding without sysfs support, the only means to
@@ -1950,7 +1950,7 @@
support link monitoring of their members, so if individual links fail,
the load will be rebalanced across the remaining devices.
- See Section 13, "Configuring Bonding for Maximum Throughput"
+ See Section 12, "Configuring Bonding for Maximum Throughput"
for information on configuring bonding with one peer device.
11.2 High Availability in a Multiple Switch Topology
@@ -2620,7 +2620,7 @@
https://lists.sourceforge.net/lists/listinfo/bonding-devel
- Discussions regarding the developpement of the bonding driver take place
+ Discussions regarding the development of the bonding driver take place
on the main Linux network mailing list, hosted at vger.kernel.org. The list
address is: