usb: musb: introduce DA8xx/OMAP-L1x glue layer
Texas Instruments DA8xx/OMAP-L1x glue layer for the
MUSBMHRDC driver.
Signed-off-by: Sergei Shtylyov <sshtylyov@ru.mvista.com>
Signed-off-by: Yadviga Grigorieva <yadviga@ru.mvista.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
diff --git a/drivers/usb/musb/Kconfig b/drivers/usb/musb/Kconfig
index cfd38ed..1dd21c2 100644
--- a/drivers/usb/musb/Kconfig
+++ b/drivers/usb/musb/Kconfig
@@ -45,6 +45,9 @@
comment "DaVinci 35x and 644x USB support"
depends on USB_MUSB_HDRC && ARCH_DAVINCI_DMx
+comment "DA8xx/OMAP-L1x USB support"
+ depends on USB_MUSB_HDRC && ARCH_DAVINCI_DA8XX
+
comment "OMAP 243x high speed USB support"
depends on USB_MUSB_HDRC && ARCH_OMAP2430
@@ -144,7 +147,7 @@
config MUSB_PIO_ONLY
bool 'Disable DMA (always use PIO)'
depends on USB_MUSB_HDRC
- default y if USB_TUSB6010
+ default USB_TUSB6010 || ARCH_DAVINCI_DA8XX
help
All data is copied between memory and FIFO by the CPU.
DMA controllers are ignored.