commit | c3078f4c9643f8320b6e09ea7fc4bed1915abbd1 | [log] [tgz] |
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author | Bruno Martins <bgcngm@gmail.com> | Sun Jun 23 12:39:38 2024 +0100 |
committer | Michael Bestas <mkbestas@lineageos.org> | Mon Jul 08 15:44:01 2024 +0300 |
tree | f814d16e1fe8d66f331d281ea79301fee03adb1e | |
parent | a6ac8e41ca6fe51d41294175b710272526c74aa8 [diff] |
FP5: Unset BUILD_BROKEN_INCORRECT_PARTITION_IMAGES Qualcomm targets can now build hermetic partitions. Change-Id: I241105e01d85fea983b34846ca675666ac07541b
Device | Fairphone 5 |
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SoC | Qualcomm QCM6490 (SM7325) |
QCOM Board Platform | lahaina |
CPU | (1) x 2.7 GHz Kryo 670 Gold Plus, (3) x 2.4 GHz Kryo 670 Gold, (4) x 1.9 GHz Kryo 670 Silver |
GPU | Adreno 643 |
Memory | 8GB RAM |
Shipping Android version | 13 |
Storage | 256GB |
Battery | Removable Li-Ion 4200 mAh |
Dimensions | 161.6 x 75.83 x 9.6 mm |
Display | 2770 x 1224 (20:9), 6.46 inch |
Rear camera 1 | 50MP, f/1.88 (Wide) Dual LED flash |
Rear camera 2 | 50MP, f/2.2 (Ultra Wide) |
Rear camera 3 | TOF 3D (Depth) |
Front camera | 50MP, f/2.45 (Wide) |
Network | GSM / HSPA / LTE / 5G |